Soldering such as: SOIC.CHIP.QFP.PLCC.BGA... etc...
2.Used for the caloric shrink, dry,divided by the lacker and divided by to glue,defrost, preheat,disinfect, the glue welds the iso.
3.blow soldering band lastics component, the machine of ringing,the tail puts the constant shape in iso - in mount in diamidine in inside, blow soldering wireways board anti effervescence.Dismantle the constant color in housing in plate, blow the core plate of BGA to break not easily.
3.heat with quick,3 seconds arrive the setting temperature, the intelligence induceds.
Power supply voltage: Ac: 220V/50Hz
Soldering iron pen:
Power dissipation:45-60W
Temperature range:200°C- 480°C
Heating element:Ceramic longevity life heat
Defend to oxidize the soldering:The high conduction is lengthways the life
Output voltage:22V