Suit to many solder station: SOIC、CHIP、QEP、PLCC、BGA and so on.
2. Be use heat shrink、drying 、get rid of lacquer and adhibit、ice-out. warm-up 、antisepsis 、soldering glue and so on.
3. Bring plastic element to blow jointing, shakeing. caudal of socket all ametabolic, plugboard un dunk. Dismantle cover screen fixedness colour, blow BGA CMOS chip hot easy to break.
4. Temperature go up quickly, three seconds come, LED show the
temperature, feel aptitude, cooling by self, close delay.
Technical Parameters
Power Supply:Ac:220V /50Hz 110V/60Hz
Soldering iron station
Power consume: 40W (30V-90W P-P)
Bound of temperature: 200°C-480°C
Heat element: Life long Chinaware element
No Pb prevent oxidation solder bit: high conduct life long time
Solder bit resistance growning: