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Relife Rl-044 Precision Bga Stencil for Micro Electronics Repair
Other
Type
Brand New
Condition
RELIFE RL-044 Precision BGA Stencil, a specialized tool used for micro-electronics repair to reball integrated circuit chips.
Function: Features precise round and square holes for applying solder paste to BGA pads with high accuracy.
Design: Ultra-thin 0.12 mm steel mesh designed for rapid heat dissipation to prevent component damage.
Compatibility: Designed for repairing chips in various devices, including iPhone, Huawei, Samsung, and Xiaomi.
Process: Utilizes a half-etching process to create grooves that help prevent burns and damage during the repair process.
Safety tips
- Avoid paying in advance, even for delivery
- Meet with the seller at a safe public place
- Inspect the item and ensure it's exactly what you want
- Make sure that the packed item is the one you've inspected
- Only pay if you're satisfied
