Enterprise
1/3
Kyetumbuddwa
Kampala, Central Division, Obaddeko 1 essaawa emabega
61 okulabibwa
Thermal Paste for Computer
YJ-G190
Ekifaananyi ky'ekikozesebwa
Thermal paste
Ekika
Ekipya
Embeera
Adireesi y'edduuka
Kampala • Rubaga
Nateete - in the market near traffic 🚦 lights.
Call when you're at the main gate or at traffic 🚦 lights"
Kigguddwawo kati
• Bal - Sab, 06:00-21:00
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation.
Amagezi ag’okukuuma obulungi
- Weewaleko okusasula kuddala, ne bwe kuba kuduusa
- Sisinkananga omutunzi mu kifo eky'ekwerinda ekirikimu abantu abangi
- Kebera ekintu era okakase nti kye ky'oyagala ddala
- Kakasa nti ekintu ekyazibwamu kye werekebako.
- Sasula bw'oba nga omusanyufu bokka
