Imefaulu
Kampala, Idara ya Kati, masaa 2 yaliyopita
18 maoni
Sunshine BGA Reballing Stencil for Phone Repair
Nyingine
Aina
Other
Chapa
Chapa Mpya
Hali
Sunshine BGA Reballing Stencil made by Guangzhou Sunshine Electronics Technology, designed as a precision steel mesh template for CPU and IC chip tin planting during mobile phone board : Guangzhou Sunshine Electronics Technology Co., Ltd.Function: Used for thermal reballing and aligning solder balls on smartphone integrated circuits.Standard: Manufactured under executive standard Q/XXDZ 014-2023
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