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Kampala, Idara ya Kati, 27 min ago
30 maoni

Relife Rl-044 Precision Bga Stencil for Micro Electronics Repair

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RELIFE RL-044 Precision BGA Stencil, a specialized tool used for micro-electronics repair to reball integrated circuit chips. Function: Features precise round and square holes for applying solder paste to BGA pads with high accuracy. Design: Ultra-thin 0.12 mm steel mesh designed for rapid heat dissipation to prevent component damage. Compatibility: Designed for repairing chips in various devices, including iPhone, Huawei, Samsung, and Xiaomi. Process: Utilizes a half-etching process to create grooves that help prevent burns and damage during the repair process.
Relife Rl-044 Precision Bga Stencil for Micro Electronics Repair
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